Cooling of microelectronic and nanoelectronic equipment : advances and emerging research /
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Corporate Author: | |
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Other Authors: | , , |
Format: | Electronic eBook |
Language: | English |
Published: |
Singapore :
World Scientific Publishing Company,
2015.
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Series: | WSPC series in advanced integration and packaging ;
v. 3. |
Subjects: | |
Online Access: |
Full text (Wentworth users only) |