Hermeticity testing of MEMS and microelectronic packages /
Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mecha...
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Main Authors: | , |
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Format: | Electronic eBook |
Language: | English |
Published: |
Boston :
Artech House,
[2013]
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Series: | Artech House integrated microsystems series.
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Subjects: | |
Online Access: |
Full text (Wentworth users only) |
Local Note: | ProQuest Ebook Central |