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  1. 1
    Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu.

    Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT...

    Published 2014
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  2. 2
    IMAPS Poland 2016.

    IMAPS Poland 2016. by Goosey, Martin

    Published 2017
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  3. 3
    Adhesion in microelectronics / edited by K.L. Mittal and Tanweer Ahsan.

    Adhesion in microelectronics / edited by K.L. Mittal and Tanweer Ahsan.

    Published 2014
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  4. 4
    Microwave and Millimeter-Wave Electronic Packaging.

    Microwave and Millimeter-Wave Electronic Packaging. by Sturdivant, Rick

    Published 2013
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  5. 5
    Hermeticity testing of MEMS and microelectronic packages / Suzanne Costello, Marc P.Y. Desmulliez.

    Hermeticity testing of MEMS and microelectronic packages / Suzanne Costello, Marc P.Y. Desmulliez. by Costello, Suzanne, Desmulliez, Marc P. Y., 1963-

    Published 2013
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  6. 6
    IMAPS (2016).

    IMAPS (2016). by Baoyong, Chi

    Published 2017
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  7. 7
    LCP for microwave packages and modules / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara.

    LCP for microwave packages and modules / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara.

    Published 2012
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  8. 8
    Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu, Yong Liu.

    Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu, Yong Liu. by Liu, S. (Sheng), 1963-

    Published 2011
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  9. 9
    Lead-free solder interconnect reliability / edited by Dongkai Shangguan.

    Lead-free solder interconnect reliability / edited by Dongkai Shangguan.

    Published 2005
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  10. 10
    Semiconductor Packaging : Materials Interaction and Reliability.

    Semiconductor Packaging : Materials Interaction and Reliability. by Chen, Andrea

    Published 2011
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  11. 11
    Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee.

    Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee. by Lau, John H.

    Published 2001
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  12. 12
    Area array packaging handbook / Ken Gilleo.

    Area array packaging handbook / Ken Gilleo. by Gilleo, Ken

    Published 2002
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  13. 13
    Fundamentals of microsystems packaging / edited by Rao R. Tummala.

    Fundamentals of microsystems packaging / edited by Rao R. Tummala.

    Published 2001
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  14. 14
    Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials / John H. Lau . [et al.].

    Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials / John H. Lau . [et al.].

    Published 2003
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  15. 15
    Electronic materials and processes handbook Charles A. Harper, editor in chief.

    Electronic materials and processes handbook Charles A. Harper, editor in chief.

    Published 2003
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  16. 16
    Semiconductor manufacturing handbook / edited by Hwaiyu Geng.

    Semiconductor manufacturing handbook / edited by Hwaiyu Geng.

    Published 2005
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  17. 17
    Microprocessor design : a practical guide from design planning to manufacturing / Grant McFarland.

    Microprocessor design : a practical guide from design planning to manufacturing / Grant McFarland. by McFarland, Grant (Grant W.)

    Published 2006
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  18. 18
    Introduction to system-on-package (SOP) : miniaturization of the entire system / Rao R. Tummala, Madhavan Swaminathan.

    Introduction to system-on-package (SOP) : miniaturization of the entire system / Rao R. Tummala, Madhavan Swaminathan. by Tummala, Rao R., 1942-

    Published 2008
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  19. 19
    Advanced MEMS packaging / John H. Lau . [et al.].

    Advanced MEMS packaging / John H. Lau . [et al.].

    Published 2010
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  20. 20
    Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition / Rao Tummala.

    Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition / Rao Tummala. by Tummala, Rao

    Published 2019
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