Wentworth
Institute of Technology
Suggested Topics within your search.
Suggested Topics within your search.
- Electronic apparatus and appliances
- Electronic packaging 6
- Microelectronic packaging
- Electronics 4
- Materials 4
- Adhesives 3
- Design and construction 3
- Integrated circuits 3
- Integrated circuits industry 2
- Manufacturing processes 2
- Microelectronics 2
- Printed circuits 2
- Solder and soldering 2
- Surface mount technology 2
- Temperature control 2
- Testing 2
- Ball grid array technology 1
- Chip scale packaging 1
- Costs 1
- Design 1
- Electric insulators and insulation 1
- Electronic ceramics 1
- Electronics industries 1
- Environmental aspects 1
- Environmental protection 1
- Flip chip technology 1
- Green products 1
- Halocarbons 1
- Hermetic sealing 1
- Integrated passive components 1
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1
Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT...
Published 2014Full text (Wentworth users only)
Electronic Conference Proceeding eBook -
2
Area array packaging handbook / Ken Gilleo.
Published 2002Full text (Wentworth users only)
Electronic eBook -
3
Fundamentals of microsystems packaging / edited by Rao R. Tummala.
Published 2001Full text (Wentworth users only)
Electronic eBook -
4
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5
Electronic materials and processes handbook Charles A. Harper, editor in chief.
Published 2003Full text (Wentworth users only)
Electronic eBook -
6
Components, packaging and manufacturing technology selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 20...
Published 2011Full text (Wentworth users only)
Electronic Conference Proceeding eBook