Handbook of 3D integration. edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm.

Table of Contents: “…2.3 3D Integration-Focused Activities -- The Global IP Landscape2.4 Applications, Technology, and Market Trends; References; 3 Economic Drivers and Impediments for 2.5D/3D Integration; 3.1 3D Performance Advantages; 3.2 The Economics of Scaling; 3.3 The Cost of Future Scaling; 3.4 Cost Remains the Impediment to 2.5D and 3D Product Introduction; 3.4.1 Required Economics for Interposer Use in Mobile Products; 3.4.2 Silicon Interposer Pricing; References; 4 Interposer Technology; 4.1 Definition of 2.5D Interposers; 4.2 Interposer Drivers and Need; 4.3 Comparison of Interposer Materials.…”
Full text (Wentworth users only)

Handbook of 3D integration. edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm.

Table of Contents: “…2.3 3D Integration-Focused Activities -- The Global IP Landscape2.4 Applications, Technology, and Market Trends; References; 3 Economic Drivers and Impediments for 2.5D/3D Integration; 3.1 3D Performance Advantages; 3.2 The Economics of Scaling; 3.3 The Cost of Future Scaling; 3.4 Cost Remains the Impediment to 2.5D and 3D Product Introduction; 3.4.1 Required Economics for Interposer Use in Mobile Products; 3.4.2 Silicon Interposer Pricing; References; 4 Interposer Technology; 4.1 Definition of 2.5D Interposers; 4.2 Interposer Drivers and Need; 4.3 Comparison of Interposer Materials.…”
Full text (Wentworth users only)