SiC power module design : performance, robustness and reliability /

Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carb...

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Bibliographic Details
Corporate Author: Knovel (Firm)
Other Authors: Castellazzi, Alberto (Editor), Irace, Andrea (Editor)
Format: Electronic eBook
Language:English
Published: London, United Kingdom : The Institution of Engineering and Technology, 2021.
Series:IET energy engineering series ; 151.
Subjects:
Online Access: Full text (Wentworth users only)